产品描述:
对环境污染的控制已成为经济发展中的首要义题,锡铅焊料是一种高度有毒的金属合金,它作为组装辅料被广泛用于现代电子组装工业。随着欧美RoHS指令的实施,电子产品制造商已经趋向于焊料的无铅化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
产品特性:该产品是残留物无色透明,活性适中,BGA空洞率低,手动印刷不费力,主要用于中高端产品,如DVD,机顶盒等
产品规格:Solder Specfications
合金成分Composition of solder alloy
焊接合金之物理性质Solder alloy physical properties
锡粉规格Solder powder specification
技术数据:
物理性质Physical properties
化学性质Chemical properties
电气性能