How to choose solder paste in SMT production process?

As the current mainstream SMT production process, the material selection of SMT soldering in the production process is very important, and the selection of solder paste is particularly critical. The right solder paste can improve product quality, reduce damage, and reduce production costs. Today, Nofil solder paste manufacturers will take you to understand how to choose solder paste in the SMT production process.

When choosing solder paste in the SMT production process, due to the wide variety of solder, we need to choose according to the needs of our own products, process flow and cleaning methods, as follows:

1. For electronic products that are not intended to be cleaned after soldering, no-clean solder paste is preferred. When sizing, attention should be paid to its compatibility with pre-applied fluxes and its suitability to the foaming process, as this solder paste has low residues.

2. If the electronic product needs to be cleaned after soldering, the solder paste should be selected according to the cleaning process. For example, if water washing is used, a water-soluble solder paste can be used for PCB soldering (if an organic ammonia saponifier is used).

3. No matter what type of solder paste is chosen, you should pay attention to the quality of the solder paste itself and the adaptability to the welding machine, especially the PCB preheating temperature, which is the primary condition to ensure the realization of the function of the solder paste.

4. If you choose VOC no-clean solder paste, you should pay attention to the compatibility with the equipment, such as the corrosion resistance of the equipment, whether the preheating temperature is appropriate (usually requires an appropriate increase), and whether the PCB substrate is adaptable, for example, some substrates have high water absorption and are prone to bubble defects.

The selection of solder paste is only an important part of the SMT production process, but there are many other aspects of the SMT production process that need to be carefully controlled. For example, the placement accuracy of a component has a profound impact on the quality of the final product. High-precision placement ensures the stability of the circuit connection and reduces the risk of failure due to poor connection. In this regard, advanced placement machine equipment and precise programming settings are the key to achieving high-precision placement.

In addition, the temperature profile setting of reflow soldering is also a factor that cannot be ignored. Different types of components and PCBs may require different reflow temperature profiles to ensure solder quality. A reasonable temperature profile can ensure that the solder paste melts and solidifies within a suitable time, and avoids problems such as virtual soldering and overwelding. At the same time, humidity and temperature control are also important for the production environment, which can affect the performance of the solder paste and the performance of the components.

In addition, quality control is also crucial in the SMT production process. Including visual inspection, electrical performance testing and other inspection processes, it can find the problems in the production process in time, and avoid defective products from flowing into the next process or finally reaching consumers. Through these comprehensive quality control measures, we can ensure the efficient and stable operation of the SMT production process and produce high-quality electronic products.

That's all there is to choosing a solder paste for the SMT production process. For more information about solder, you can search for "Suzhou Nofer" to view. We will update the information regularly, welcome to follow, thank you very much.