Several solutions for mounting SMD on FPC

In the mounting process, based on the strict requirements for mounting accuracy and the diversity of component types and quantities, Suzhou Nofel has carefully formulated the following two mainstream solutions to meet the needs of different production scenarios.

Option 1: Multi piece integrated mounting

This scheme cleverly places multiple FPCs on the pallet with precise positioning templates, achieving full process fixation and synchronous SMT mounting. It has a wide range of applications, including but not limited to:

Component types: including chip components with a volume greater than 0603, QFQ components with a pin spacing of not less than 0.65mm, and other types of components.

Number of components: On each FPC, whether it is a sparse number of components or a dense dozen or so components, they can be easily handled.

Mounting accuracy: This solution focuses on medium precision mounting requirements, ensuring that every product meets the standards.

FPC features: Suitable for FPC with moderate area and reasonable layout, requiring a free area without components, and equipped with two optical positioning MARK marks and two or more positioning holes for precise positioning.

In the FPC fixing process, we carefully create high-precision FPC positioning templates based on the CAD data of the metal leakage plate. By accurately matching the diameter and height (approximately 2.5mm) of the positioning pin and positioning hole, the FPC is ensured to be stable and not move. Meanwhile, the preferred material for the pallet is FR-4 and other high-quality heat-resistant materials, with a thickness maintained at around 2mm to reduce deformation under thermal shock. Before SMT operation, precisely align the pallet with the template, then insert the FPC into the positioning pin one by one, and use thin high-temperature resistant tape (such as PA protective film) for stable fixation to ensure smooth welding, printing, and mounting. It is particularly emphasized that the storage time of FPC fixed to solder printing should be minimized as much as possible to avoid unnecessary risks.

Option 2: High precision individual mounting

This solution is designed specifically for high-precision mounting requirements and supports the individual mounting of one or several FPCs on high-precision positioning pallets. Its unique advantages are reflected in:

Component type: Almost covers all conventional components, including high-precision QFP with pin spacing less than 0.65mm.

Component Quantity: Easily handle high-density mounting requirements with over dozens of components.

Mounting accuracy: Achieving ultimate mounting accuracy, even when facing QFP with a spacing of 0.5mm, it can ensure perfect mounting.

FPC features: Suitable for large area and complex layout FPCs, equipped with multiple positioning holes and optical positioning MARK marks to ensure seamless docking during the mounting process.

In terms of FPC fixation, we use batch customized high-precision positioning pallets, and each pallet undergoes strict quality control to ensure positioning accuracy and stability. There are two types of positioning pins on the pallet, which are used to match the thickness of FPC and limit its offset, ensuring the accuracy of mounting. In addition, regarding the moisture sensitivity of FPC, we recommend conducting sufficient dehumidification and drying treatment before installation to ensure installation quality.

In terms of process requirements and precautions, we emphasize the rigorous operation of key links such as the fixing direction of FPC, the storage and preparation of solder paste, the control of environmental temperature and humidity, and the selection and production of metal leakage plates. Especially during the reflow soldering stage, we recommend using mandatory hot air convection infrared reflow soldering equipment and adjusting the temperature curve and transfer speed according to actual production conditions to ensure stable and reliable welding quality.

In summary, we are committed to providing optimal solutions for FPC fixation, solder paste selection and printing, and fine control of reflow soldering. By continuously optimizing process parameters and strengthening production control, we have kept the defect rate of SMT production at an extremely low level, ensuring that every product meets customer expectations and requirements.