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What is the SMT red glue process?
2026-02-06
What is the SMT red glue process?

What is the SMT red glue process?

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Analysis of the difference between solder paste mesh and red glue mesh in SMT chip processing
2026-02-05
Analysis of the difference between solder paste mesh and red glue mesh in SMT chip processing

Analysis of the difference between solder paste mesh and red glue mesh in SMT chip processing

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Conductive Epoxy Adhesive (ECA) Technology Analysis and Application
2026-02-04
Conductive Epoxy Adhesive (ECA) Technology Analysis and Application

Conductive Epoxy Adhesive (ECA) Technology Analysis and Application

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Panoramic analysis of packaging substrate technology and exploration of industrial development path
2026-02-03
Panoramic analysis of packaging substrate technology and exploration of industrial development path

Panoramic analysis of packaging substrate technology and exploration of industrial development path

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BGA failure mode analysis
2026-02-02
BGA failure mode analysis

BGA failure mode analysis

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Laser ball implantation - bump production process on BGA chip packaging
2026-02-01
Laser ball implantation - bump production process on BGA chip packaging

Laser ball implantation - bump production process on BGA chip packaging

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What are the methods of BGA ball planting?
2026-01-31
What are the methods of BGA ball planting?

What are the methods of BGA ball planting?

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BGA packaging process flow
2026-01-30
BGA packaging process flow

BGA packaging process flow

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Detailed explanation of the BGA packaging process
2026-01-29
Detailed explanation of the BGA packaging process

Detailed explanation of the BGA packaging process

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Low-temperature conductive silver glue: characteristic analysis and application prospects
2026-01-28
Low-temperature conductive silver glue: characteristic analysis and application prospects

Low-temperature conductive silver glue: characteristic analysis and application prospects

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SMT SMT reflow soldering defects and solutions
2026-01-27
SMT SMT reflow soldering defects and solutions

SMT SMT reflow soldering defects and solutions

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Industrialization and technological breakthroughs of tin-based new materials
2026-01-26
Industrialization and technological breakthroughs of tin-based new materials

Industrialization and technological breakthroughs of tin-based new materials

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We are mainly engaged in the research, development and production of solder paste, tin ball, electronic flux, industrial cleaning agent, lead-free solder wire, solder bar, solder sheet, and insulating varnish. The sales network covers all provinces of China and more than ten countries and regions in the world.

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